@inproceedings{BMM+13,
title = { {Co-Simulation of Functional SystemC TLM Models with Power/Thermal Solvers} },
author = {Bouhadiba, Tayeb and Moy, Matthieu and Maraninchi, Florence and Cornet, J\'er\^ome and Maillet-Contoz, Laurent and Materic, Ilija},
month = {May},
year = {2013},
booktitle = {{Virtual Prototyping of Parallel and Embedded Systems (VIPES)}},
address = {Boston, {\'E}tats-Unis},
pages = {?},
team = {SYNC},
hal_id = {hal-00807354},
language = {Anglais},
affiliation = {VERIMAG - VERIMAG - IMAG , STMicroelectronics (Grenoble) - ST-GRENOBLE , Docea Power},
audience = {internationale},
pdf = {http://hal.archives-ouvertes.fr/hal-00807354/PDF/vipes2013.pdf},
abstract = {{Modern systems-on-chips need sophisticated power-management policies to control their power consumption and temperature. These power-management policies are usually implemented partly in software, with hardware support. They need to be validated early, hence power and temperature-aware simulation techniques at the system-level need to be developed. Existing approaches for system-level power and thermal analysis usually either completely abstract the functionality (allowing only simple scenarios to be simulated), or run the functional simulation independently from the non-functional one. The approach presented in this paper allows a coupled simulation of a SystemC/TLM model, possibly including the actual embedded software, with a power and temperature solver such as ATMI or the commercial tool ACEplorer. Power and temperature analysis is done based on the stimuli sent by the SystemC/TLM platform, which in turn can take decisions based on the non-functional simulation.}},
}
