title = { {Co-Simulation of Functional SystemC TLM Models with Power/Thermal Solvers} },
    author = {Bouhadiba, Tayeb and Moy, Matthieu and Maraninchi, Florence and Cornet, J\'er\^ome and Maillet-Contoz, Laurent and Materic, Ilija},
    month = {May},
    year = {2013},
    booktitle = {{Virtual Prototyping of Parallel and Embedded Systems (VIPES)}},
    address = {Boston, {\'E}tats-Unis},
    pages = {?},
    team = {SYNC},
    hal_id = {hal-00807354}, language = {Anglais}, affiliation = {VERIMAG - VERIMAG - IMAG , STMicroelectronics (Grenoble) - ST-GRENOBLE , Docea Power}, audience = {internationale}, pdf = {},
    abstract = {{Modern systems-on-chips need sophisticated power-management policies to control their power consumption and temperature. These power-management policies are usually implemented partly in software, with hardware support. They need to be validated early, hence power and temperature-aware simulation techniques at the system-level need to be developed. Existing approaches for system-level power and thermal analysis usually either completely abstract the functionality (allowing only simple scenarios to be simulated), or run the functional simulation independently from the non-functional one. The approach presented in this paper allows a coupled simulation of a SystemC/TLM model, possibly including the actual embedded software, with a power and temperature solver such as ATMI or the commercial tool ACEplorer. Power and temperature analysis is done based on the stimuli sent by the SystemC/TLM platform, which in turn can take decisions based on the non-functional simulation.}},


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